- If instead your model is Samsung MS28 you PSB will be covered by a black and hard paste… very hard, as I will explain you later, my suggestion is to keep calm and the Dichloromethane, the job would be cleaner and safer. Using a cutter o hot air that could permanently damage the PSB of the Drive

- I suggest to totally remove the resin protection from the Flash of the Drive, to do this it is wise using Dichloromethane (available in solvent/paint stores). The use of this solvent is particularly delicate, should be manipulated using protective gloves and in a well ventilated area. If you are the owner of a Samsung MS25, the resin elimination is quite fast. Just drop of 3mm of solvent on top and wait… after approximately 3 hrs it is possible to remove it using a cotton bud or a toothpick., you should see that the resin paste has been completely removed leaving your Flash perfectly clean.

- If instead you have a Samsung MS28 (with the black paste) the job would be slightly longer… in fact the process should take 8/10 hours longer and the process should be repeated several times and it is not sure that all that paste would disappear, anyway I can assure you that the working zone should be free and clean. I need to precise that the solvent you are using does not damage in any way the components of the Drive.

After the process is done, if you have a Samsung MS25 you PCB should be clean as follows:

Let’s now have a look at our Flat Model, as you can see a part of it fits in directly on the Flash of the Drive it’s another like a glove.

We can notice the other assembling side is quite clear: in regards of the Chip just fit together in a way so it matches the corresponding numbers with the Flat model. In regards of the assembling of the Flash make sure that "+5V" and "X0" are faced up and not toward the PCB of the Drive:

After that I advise you to continue the fixing of the Flat directly on the Chip: fit the plate so that it’s connects their respective points on the Infectus. Then using the soldering wire and the Fluxant and solder them together. At the end we should have something like that:

We now can work with on the Drive: first of all, you should, follow the original assembling diagram of the Infectus pull out 2 wires, on for the +5V and the other one for the X0 point:

One after the other proceed by cutting the connection between points 00 and Xo (see picture above), this will permit the chip to switch between the FW original and the FW Hack, the soldered wire previously are not to be connect right now, so move them away so that they don’t get in your way:

As shown in the picture place the Flat directly on the Flash:

And proceed with the help of the Fluxant and the soldering of all the point carried over on the plate. Once all the points fixed we can solder the two wires previously left apart on the plate as shown in the picture. At the end the result should love similar to this:

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Programming the Chip Infectus on Samsung reader --->